• image of 热敏 - 散热器>APF30-30-13CB/A01
  • image of 热敏 - 散热器>APF30-30-13CB/A01
  • image of 热敏 - 散热器>APF30-30-13CB/A01
  • image of 热敏 - 散热器>APF30-30-13CB/A01
APF30-30-13CB/A01
热敏 - 散热器
CTS Thermal Management Products
HEATSINK FORGED
-
Box
-

captcha
image of 热敏 - 散热器>APF30-30-13CB/A01
image of 热敏 - 散热器>APF30-30-13CB/A01
image of 热敏 - 散热器>APF30-30-13CB/A01
APF30-30-13CB/A01
热敏 - 散热器
CTS Thermal Management Products
HEATSINK FORGED
-
Box
-
TYPEDESCRIPTION
MfrCTS Thermal Management Products
SeriesAPF
PackageBox
Product StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Fins
Length1.181" (30.00mm)
Width1.181" (30.00mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow2.50°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Shelf Life24 Months
Base Product NumberAPF30
1.jpg
 Orignal genuine       Each chip comes from the original factory


2.jpg
       

 Main products       Only make original stock


3.jpg
        

 Spot inventory       Only make original stock

4.jpg       

Original stockBom DistributioAffordable Price


+8615989434812

hito@hitotrade.com
0