: | APF30-30-13CB/A01 |
---|---|
: | 热敏 - 散热器 |
: | CTS Thermal Management Products |
: | HEATSINK FORGED |
: | - |
: | Box |
: | - |
TYPE | DESCRIPTION |
Mfr | CTS Thermal Management Products |
Series | APF |
Package | Box |
Product Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Fins |
Length | 1.181" (30.00mm) |
Width | 1.181" (30.00mm) |
Diameter | - |
Fin Height | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 2.50°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Material | Aluminum |
Material Finish | Black Anodized |
Shelf Life | 24 Months |
Base Product Number | APF30 |
Orignal genuine | Each chip comes from the original factory |
| |
Main products | Only make original stock |
| |
Spot inventory | Only make original stock |
|
Original stock | Bom Distributio | Affordable Price |