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BDN09-3CB/A01
热敏 - 散热器
CTS Thermal Management Products
HEATSINK CPU W/
-
Box
-

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image of 热敏 - 散热器>BDN09-3CB/A01
image of 热敏 - 散热器>BDN09-3CB/A01
image of 热敏 - 散热器>BDN09-3CB/A01
image of 热敏 - 散热器>BDN09-3CB/A01
BDN09-3CB/A01
热敏 - 散热器
CTS Thermal Management Products
HEATSINK CPU W/
-
Box
-
TYPEDESCRIPTION
MfrCTS Thermal Management Products
SeriesBDN
PackageBox
Product StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length0.910" (23.11mm)
Width0.910" (23.11mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.60°C/W @ 400 LFM
Thermal Resistance @ Natural26.90°C/W
MaterialAluminum
Material FinishBlack Anodized
Shelf Life24 Months
Base Product NumberBDN09
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 Orignal genuine       Each chip comes from the original factory


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 Main products       Only make original stock


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 Spot inventory       Only make original stock

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Original stockBom DistributioAffordable Price


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