: | BDN10-3CB/A01 |
---|---|
: | 热敏 - 散热器 |
: | CTS Thermal Management Products |
: | HEATSINK CPU W/ |
: | - |
: | Box |
: | - |
TYPE | DESCRIPTION |
Mfr | CTS Thermal Management Products |
Series | BDN |
Package | Box |
Product Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Pin Fins |
Length | 1.010" (25.65mm) |
Width | 1.010" (25.65mm) |
Diameter | - |
Fin Height | 0.355" (9.02mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 400 LFM |
Thermal Resistance @ Natural | 26.40°C/W |
Material | Aluminum |
Material Finish | Black Anodized |
Shelf Life | 24 Months |
Base Product Number | BDN10 |
Orignal genuine | Each chip comes from the original factory |
| |
Main products | Only make original stock |
| |
Spot inventory | Only make original stock |
|
Original stock | Bom Distributio | Affordable Price |